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Dual-chamber four-target magnetron sputtering coating machine
This device is used for depositing metal films, ceramic films, dielectric films, etc., through magnetron sputtering. Users can choose from various operating modes according to their process needs, including single-target independent operation, four-target alternating operation, or any combination of four-target co-sputtering. The device consists of two vacuum chambers: the main chamber and the preparation chamber. The main chamber is used for film deposition, completing the user's primary coating process. The preparation chamber is connected to the main chamber via a high-vacuum gate valve and can be used for plasma cleaning of substrates before coating and films after coating, allowing for substrate replacement without disrupting the vacuum in the main chamber.
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1. Application Field
This device is used to deposit metal films, ceramic films, dielectric films, etc., through magnetron sputtering. Users can choose from various working modes according to process requirements, including single-target independent operation, four-target alternating operation, or any combination of four-target co-sputtering. The device consists of two vacuum chambers: the main chamber and the preparation chamber. The main chamber is used for film deposition, completing the user's main coating process. The preparation chamber is connected to the main chamber via a high-vacuum gate valve and can be used for plasma cleaning of substrates before and after film deposition, allowing for substrate replacement without disrupting the vacuum in the main chamber.
2. Performance Parameters
Coating Chamber:
1. Effective size approximately Φ500×550, ultimate vacuum: 5×10-5Pa;
2. Magnetron targets: 3" 4 pieces, compatible with DC and RF, adjustable target base distance and angle; equipped with pneumatic (gas) shutters;
3. Substrate size 4", capable of rotation and elevation;
4. Heating temperature 600℃, temperature control accuracy ±1 degree;
5. Sample stage rotation, speed: adjustable 2-20rpm;
6. Bias, film thickness gauge, and film ruler optional;
Preparation Chamber:
1. Effective size approximately Φ300×350; ultimate vacuum: 5×10-4Pa;
2. Chamber has self-heating baking and degassing function;
3. Ion sputtering cleaning function for substrates;
4. Equipped with a substrate library, capable of loading 4 substrates at once;
5. Magnetic sampling rod for substrate transfer.
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