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Dual-chamber multifunctional magnetron sputtering coating machine
This device is used for the deposition of various single-layer films, multi-layer films, and doped film systems. It can deposit various hard films, metal films, alloys, compounds, semiconductors, ceramic films, and dielectric composite films, as well as ferromagnetic materials. The illustrated coating machine has a dual-chamber design, sharing a high vacuum system; to avoid cross-contamination, one chamber can achieve electron gun/resistive evaporation coating, while the other chamber can achieve sputtering coating.
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Product Details
1. Application Field
This device is used for the deposition of various single-layer films, multi-layer films, and doped film systems. It can deposit various hard films, metal films, alloys, compounds, semiconductors, ceramic films, and dielectric composite films, and can also deposit ferromagnetic materials. The illustrated coating machine has a dual chamber, sharing a high vacuum system; to avoid cross-contamination, one chamber can achieve electron gun/resistive evaporation coating, while the other chamber can achieve sputtering coating.
2. Performance Parameters
1. Ultimate vacuum pressure: 5×10-5Pa;
2. Magnetron target: Diameter Φ50, Quantity: 2-4 pieces;
3. Target power density: (W/cm2) 5～20;
4. Target power supply power (W): DC500W, RF500W;
5. Substrate heating temperature: 0～500℃ controllable;
6. Process gases: MFC 1-3 channels;
7. Sample holder: Rotation speed 2-20rpm adjustable;
8. Electron gun: 1 set 6-10KW electric (pneumatic) shutter;
9. Evaporation power supply: Quantity: 1-2 sets, Power: 2KW, Voltage: 0-35V;
10. Other configurations: Bias, film thickness gauge, thin film gauge, magnetron target electric (pneumatic) shutter optional.
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