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MPO dedicated light-blocking film coating equipment

This device is a high vacuum electron beam evaporation equipment, which uses a high energy density electron beam to bombard the material to be coated, causing it to vaporize and deposit on the surface of the substrate. This equipment is used for depositing nickel-chromium alloy or other single metals and alloys on the surface of quartz or other materials. The device consists of a vertical front-opening water-cooled vacuum chamber, a vacuum system, a tooling system, an electron beam deposition system, an ion bombardment system, a heating system, a measurement and monitoring system, an electrical control system, and auxiliary systems (including frame, process gas path, compressed air path, cooling water path, and accessories).

Key words:


Product Details

The device is a high vacuum electron beam evaporation equipment, which uses a high energy density electron beam to bombard the coated material, causing it to vaporize and deposit on the substrate surface; this equipment is used to deposit nickel-chromium alloy or other single metals and alloys on the surface of quartz or other materials; the equipment consists of a vertical front-opening water-cooled vacuum chamber, vacuum system, tooling system, electron beam deposition system, ion bombardment system, heating system, measurement and monitoring system, electrical control system, and auxiliary systems (frame, process gas path, compressed air path, cooling water path, accessories), etc.

Performance parameters:

1) Deposition material: CrNi alloy (Cr80Ni20);

2) Film thickness gauge: resolution 0.01 Å;

3) Equipped with glow discharge function: maximum voltage 3KV, power 600W, 320mA, working pressure 2.0x10-2 mbar;

4) Film layer uniformity: ±5%;

5) Ultimate vacuum: 8.0x10-5 Pa;

6) Background vacuum: 5x10-4 Pa, reaching time: ≤30 min;

7) Internal cavity size of the equipment: Φ800x1000;

8) Electron gun: Φ50X25, 10KW, 270° deflection; the electron gun has arc suppression and programmable scanning functions;

9) Workpiece rotating frame: the workpiece can achieve self-rotation, double-layer placement for depositing different surfaces, and the deposition depth in micropores is determined by the workpiece placement angle; revolution speed: 1-10 rpm;

10) Heating temperature: max 300℃, working 200℃; uniformity ±2℃;

11) Control system: PC+PLC, can switch between automatic and manual control modes, multiple interlock protections, equipped with various parameter display functions and process menu storage capabilities.

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