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Universal Magnetron Sputtering Coating Machine

The magnetron sputtering coating machine is the most widely used PVD deposition equipment, suitable for various single-layer films, multi-layer films, and doped film systems. It can deposit various hard films, metal films, alloys, compounds, semiconductors, ceramic films, dielectric composite films, and other chemically reactive films, as well as ferromagnetic materials. This equipment is mainly used in laboratories for preparing optical films, electrical films, optoelectronic films, and other functional films, as well as for preparing catalyst films for the growth of nanomaterials. The equipment is widely used in colleges and universities and related research institutions.

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Product Details

1. Application Field

Magnetron sputtering coating machines are the most widely used PVD deposition equipment, suitable for various single-layer films, multi-layer films, and doped film systems. They can coat various hard films, metal films, alloys, compounds, semiconductors, ceramic films, dielectric composite films, and other chemically reactive films, and can also coat ferromagnetic materials. This equipment is mainly used for laboratory preparation of optical films, electrical, optoelectronic films, and other functional films, as well as for preparing catalyst film layers for the growth of nanomaterials. This equipment is widely used in colleges and universities and related research institutions.

2. Performance Parameters:

1. Ultimate vacuum pressure: 5×10-5Pa;

2. Magnetron target: Diameter Φ50-Φ150; Quantity: 2-4 pieces;

3. Target power density: (W/cm2) 5~20;

4. Target power (W): DC500-5000W, RF500-1000W;

5. Substrate heating temperature: 0~500℃ controllable;

6. Vacuum recovery pumping time (min): From atmosphere to 5×10-4Pa < 30min;

7. Process gas: MFC 1-4 channels;

8. Sample holder: Orbital or self-rotation;

9. Other configurations: Bias, film thickness gauge, thin film ruler, magnetron target electric (pneumatic) shutters optional;

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