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Double-chamber multifunctional magnetron sputtering coating machine
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Double-chamber multifunctional magnetron sputtering coating machine

The device is used for deposition of various monolayers, multilayers and doped films. It can be plated with hard film, metal film, alloy, compound, semiconductor, ceramic film, dielectric composite film and ferromagnetic material. As shown in the figure, the coater has two chambers, sharing a high vacuum system. In order to avoid cross contamination, one chamber can realize electron gun / resistance evaporation coating, and the other chamber can realize sputtering coating.
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1、 Application fields

The device is used for deposition of various monolayers, multilayers and doped films. It can be plated with hard film, metal film, alloy, compound, semiconductor, ceramic film, dielectric composite film and ferromagnetic material. As shown in the figure, the coater has two chambers, sharing a high vacuum system. In order to avoid cross contamination, one chamber can realize electron gun / resistance evaporation coating, and the other chamber can realize sputtering coating.

2、 Performance parameters

1. Limit vacuum pressure: 5 × 10-5pa;

2. Magnetron target: diameter: Φ 50, quantity: 2-4;

3. Target power per unit area: (w / cm2) 5-20;

4. Target power (W): dc500w, rf500w;

5. Substrate heating temperature: 0 ~ 500 ℃ controllable;

6. Process gas: MFC 1-3 channels;

7. Sample rack: Revolution 2-20rpm adjustable;

8. Electron gun: 1 set of 6-10kw electric (pneumatic) baffle;

9. Evaporation power supply: quantity: 1-2 groups, power: 2kW, voltage: 0-35v;

10. Other configuration: bias, film thickness gauge, film gauge, magnetic control target, electric (pneumatic) baffle optional;

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Beijing Zhongke Kemei Technology Co., Ltd