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Double-chamber four-target magnetron sputtering coating machine
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Double-chamber four-target magnetron sputtering coating machine

The equipment is used to deposit metal film, ceramic film, dielectric film, etc. by magnetron sputtering. Users can choose the working mode of single target independent working, four targets rotating working or four targets arbitrarily combined co sputtering according to the needs of the process. The equipment consists of two vacuum chambers, the main chamber and the preparation chamber. The main chamber is used to finish the main coating process. The preparation chamber is connected with the main chamber through a high vacuum gate valve, which can be used for plasma cleaning of the substrate before and after coating, and can replace the substrate without destroying the vacuum of the main chamber.
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1、 Application fields

The equipment is used to deposit metal film, ceramic film, dielectric film, etc. by magnetron sputtering. Users can choose the working mode of single target independent working, four targets rotating working or four targets arbitrarily combined co sputtering according to the needs of the process. The equipment consists of two vacuum chambers, the main chamber and the preparation chamber. The main chamber is used to finish the main coating process. The preparation chamber is connected with the main chamber through a high vacuum gate valve, which can be used for plasma cleaning of the substrate before and after coating, and can replace the substrate without destroying the vacuum of the main chamber.

2、 Performance parameters

Coating room:

1. The effective size is about Φ 500 × 550, and the limiting vacuum is 5 × 10-5pa;

2. Magnetic control target: 3 ″ 4, DC RF compatible, target base distance and angle adjustable; power distribution (pneumatic) baffle;

3. The substrate size is 4 ", which can be rotated and lifted;

4. The heating temperature is 600 ℃, and the temperature control accuracy is ± 1 ℃;

5. The sample table revolves, and the rotation speed is adjustable from 2 to 20rpm;

6. Bias, film thickness gauge and film gauge are optional;

Preparation room:

1. The effective size is about 300 × 350; the limiting vacuum is 5 × 10-4Pa;

2. The cavity has the function of self heating, baking and degassing;

3. Ion sputtering cleaning function for substrate;

4. Configure the substrate library, which can load 4 substrates at one time;

5. The magnetic sampling rod transmits the substrate;

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Beijing Zhongke Kemei Technology Co., Ltd